RFQ
CYTEC’s DXM Series switching systems are solid state, full fan-out matrices available in 16×16 through 128×128 configurations. Input and Output Buffers allow ECL, PECL, LVPECL, LVDS or fast RS422 two wire differential signal switching. Data rates are as high as 2 Gbps (NRZ). Control is via LAN / RS232 / GPIB or Manual.
TYPICAL APPLICATIONS INCLUDE:
The DXM Chassis are standard 19″ rack mounting anodized aluminum chassis that are built with RS232, IEEE488 and Ethernet controls. Any input connects to any or even all outputs. Systems switching Clock & Data pairs are also available. Densi-Shield input and output connectors are standard, while other connectors such as SMA or BNC can be wired out on patch panels.
These Chassis provide a non-blocking, full fan-out matrix in any configuration from 16×16 to 128×128 or larger. Both systems are capable of switching high speed differential CML up to 2.5 Gbps but are most commonly used for ECL, LVDS, LVPECL, Spacewire or RS422.
Input and Output buffer modules allow any signal type to be switched to other signals types so you can convert RS422 into LVDS or any other conversion through the switch.
The systems use high density Densi-shield cables which are taken out to patch panels for whatever type of connector you may need. This allows for ease of installation and very low MTTR since the can be removed from the rack in minutes.
Buffer modules are modular and can be changed if future needs require different signal types.
Systems may be configured as dual 32×32 or dual 64×64 for Clock and Data signals.
Densi-shield cables are rated to 2 Gbps over lengths up to 10 Meters and a single .250″ cable replaces 16 individual coax lines for cleaner installations.
Patch panels are available for almost any connector such as SMA, BNC, Twinax, Triax or D types.
Using a MESA Controller allows up to 32 Expansion Chassis to be controlled from a single IEEE488 address, RS232 or RS422 port, TTL I/O or LAN Interface. A Manual Control Option allows control of all Expansion Chassis through a front panel Keypad with LCD Display. The MESA allows cost effective building of large systems since Expansion Chassis do not require additional power supplies or Control Modules, and additional Expansion chassis can be added as your needs grow or change.
DXM 16×16 system consisting of one DXM expansion chassis, one MESA II with redundant controls and a redundant power supply chassis. SMA connectors are wired out on a separate patch panel.
Redundant, Hot Swappable Controls
The MESA II can hold two of the hot swappable CM-11 IEEE488/ RS232/Ethernet LAN Control Modules. Two control modules provide for redundancy, increasing system availability.
Redundant Hot Swappable Power Supply Chassis
The DXM Series chassis are powered by either standard internal power supplies or optionally via externally located rack mounting power supply chassis. Each rack mounting power chassis holds several plug in, hot swappable power modules, with at least two redundant modules supplying each required voltage. The separate rack mounted power supply chassis increases system availability by furnishing supplies that are both redundant and hot swappable. (See adjacent image)
The DXM Series switching systems are built with input and output buffer modules. Buffer modules are required to convert external signals (such as ECL, PECL, LVDS, etc.) to CML levels that can be handled by the solid state fabric at the heart of the switch. The switch fabric outputs CML levels which are then converted by the output buffers back to the original signal, or to a different signal type (i.e., ECL in to LVDS out) if required by the end user.
Each buffer module handles 16 differential signals. Thus, for a 16×16 configuation, one input and one output buffer module are required. Similarly, four input and four output buffer modules are needed for a 64×64 matrix, while eight of each are needed for a 128×128.
CML INPUT/OUTPUT BUFFER MODULES
The CML Input Module AC couples all inputs and provides pull up circuits to prevent unused inputs from floating and picking up crosstalk from live adjacent signals. CML Output Modules accept CML signals from the switch matrix crosspoint IC and pass them on to the output Densi-Shield connectors.
FAST RS422 OUTPUT BUFFER MODULES
These modules are intended to work with typical RS422 signal levels of 0 to 5 volts. Differential signals terminate into 100 ohms across differential pairs. Vcc is typically 3.5 V for the inputs and 5 V for the output modules.
Max. Data Rate (NRZ)
Voh – Output V High
Vol – Output V Low
Channel Propagation Delay
Ch-Ch Propagation Skew
60 Kbps min., 40 Mbps max.
3.4 V min.
0.4 V max.
3.8 nsec. typ., 4.25 nsec max.
75 psec typ., 125 psec max.
LVDS OUTPUT BUFFER MODULES
Work with typical LVDS signal levels of 1 to 1.4 volts. Differential signals terminate into 100 ohms across differential pairs. Vcc is approximately 3.0 V.
Max. Data Rate (NRZ)
Voh – Output V High
Vol – Output V Low
Vocm – Output Com Mode V
Vodiff – Output Diff. V
Channel Propagation Delay
Ch-Ch Propagation Skew
60 Kbps min., 40 Mbps max.
1.474 V max.
.925 V min.
1.125 V min., 1.375 V max
250 mV min., 450 mV max.
3.8 nsec. typ., 4.25 nsec max.
75 psec typ., 125 psec max.
ECL OUTPUT BUFFER MODULES
ECL modules are intended to work with typical ECL signal levels of -1.8 to -0.8 volts. Differential signals terminate into 50 ohms tied to -2 V. Vee is usually -5 V, while Vcc is GND.
Max. Data Rate (NRZ)
Voh – Output V High
Vol – Output V Low
Io Output Current Continuous
Channel Propagation Delay
Ch-Ch Propagation Skew
60 Kbps min., 40 Mbps max.
-0.810 V max.
-1.950 V min.
50 mA
3.8 nsec. typ., 4.25 nsec max.
75 psec typ., 125 psec max.
The DXM series chassis have I/O buffer modules that are built with high density Densi-shield connectors. These native connectors can be wired out to other common types including SMAs, BNCs, Triax, etc., located on separate rack mounting patch panels.
Patch Panels allow you to connect and disconnect the switch quickly without disturbing the SMA, BNC or Triax Connections greatly reducing MTTR and long term MTBF. Cytec can produce patch panels with almost any connector desired. Don’t see it? Just call and ask!
FCI DENSI-SHIELD I/O CONNECTORS AND CABLES
Each buffer is built with two Densi-shield connectors, and each connector handles eight differential pair signals. These connectors can be wired out using Densi-shield cables to optional patch panels with SMA, BNC, or Triax connectors.